A Short Communication — Determination of Chip and Substrate Temperatures | Zendy

M.R. Haskard | Zendy

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A Short Communication — Determination of Chip and Substrate Temperatures

Author(s) -

M.R. Haskard

Publication year - 1982

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.11.35

Subject(s) - substrate (aquarium) , heat sink , chip , materials science , heat flow , thermal , spice , optoelectronics , electronic engineering , mechanical engineering , computer science , thermodynamics , engineering , telecommunications , physics , oceanography , geology

Through making use of the analogy between electrical current and thermal heat flow, thermal calculations for thick film substrates may be undertaken using standard computer aided design programs such as SPICE 2. Chip temperature and substrate isotherms for various conditions can readily be determined. Parameters considered in this paper are chip position on substrate, with and without heat sink, number of chips on a substrate and substrate materials.

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