Examination of Thick-Films Using Modern Surface Analytical Techniques | Zendy

Gábor Harsányi | Zendy; G. Ripka | Zendy

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Examination of Thick-Films Using Modern Surface Analytical Techniques

Author(s) -

Gábor Harsányi,

G. Ripka

Publication year - 1983

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.11.219

Subject(s) - empa , impurity , materials science , surface (topology) , analytical chemistry (journal) , nanotechnology , engineering physics , metallurgy , chemistry , electron microprobe , engineering , chromatography , mathematics , geometry , organic chemistry

Modern surface analytical methods/EMPA, AES, SIMS etc. were used for studying the different layers in thick-film integrated circuits. Diffusion and migration effects, surface impurity distributions and surface compositions were examined. Some of the results are presented in this paper. Electrical measurements are not discussed here; only examples of the practical use of the methods are demonstrated.

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