Open AccessCompliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
Author(s) -
A. Kerkhoff
Publication year - 1983
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.11.165
Subject(s) - packaging engineering , engineering , manufacturing engineering , computer science , mechanical engineering
Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained a recognized position in the European and US markets.
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