Fine Lines in a Three Dimensional Interconnect | Zendy

J A Scarlett | Zendy

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Fine Lines in a Three Dimensional Interconnect

Author(s) -

J A Scarlett

Publication year - 1983

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.11.109

Subject(s) - interconnection , printed circuit board , planar , reliability (semiconductor) , dissipation , chip , line (geometry) , line width , materials science , integrated circuit , thermal management of electronic devices and systems , electrical engineering , electronic engineering , computer science , engineering , optoelectronics , mechanical engineering , telecommunications , physics , optics , power (physics) , computer graphics (images) , geometry , mathematics , quantum mechanics , thermodynamics

The techniques for the generation of fine lines on rigid and flexible printed circuit boards are reviewed, and it is shown how the tracking on the interconnect can be made to match the requirements of chip carriers, TAB chips or beam leaded or wire bonded chips directly mounted.

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