Parameters That Influence the Ultrasonic Bond Quality | Zendy

P. L. L. M. Derks | Zendy

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Parameters That Influence the Ultrasonic Bond Quality

Author(s) -

P. L. L. M. Derks

Publication year - 1982

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.10.269

Subject(s) - ultrasonic sensor , bond , quality (philosophy) , materials science , environmental science , acoustics , business , physics , finance , quantum mechanics

This paper summarizes some non-destructive ultrasonic bond quality test methods. Systems described in the literature are mainly based on monitoring the deviation of the vibration amplitude during welding and the correlation between the bond strength with these deviations. Practical application of these principles can give discouraging results. A better understanding of the bond formation process should enable one to understand what causes the amplitude to deviate, and why this is strongly dependent on the ultrasonic bond system involved.

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