Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits | Zendy

Ch. Zimmer | Zendy

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Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits

Author(s) -

Ch. Zimmer

Publication year - 1982

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.10.209

Subject(s) - electronic circuit , analogue electronics , computer science , electronic engineering , electrical engineering , materials science , engineering

The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered to multilayer thick-film circuits, mounted on metallic heat sinks. The multi-layer structure contains silver bearing conductors and supports trimmable resistors. The information presented concerns mainly the fabrication of the thick-film circuits and the thermal design.

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