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The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered to multilayer thick-film circuits, mounted on metallic heat sinks. The multi-layer structure contains silver bearing conductors and supports trimmable resistors. The information presented concerns mainly the fabrication of the thick-film circuits and the thermal design.

Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits