z-logo
open-access-imgOpen Access
Experience With Polymer Thick Film Technology
Author(s) -
Raimo Hulkkonen,
E. Jarvinen,
Vesa Sortti
Publication year - 1981
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.10.135
Subject(s) - materials science , polymer , polymer science , composite material
The paper describes a user's experiences with polymer thick film resistor technology. The characteristics studied are resistance values and their distributing. Parameters affecting these characteristics are the material of the substrate, and the curing of the polymer resistor paste. The test conditions (temperature cycling, dip soldering, high temperature storaging) were chosen to simulate the environmental conditions, through which the polymer resistor circuits have to go during the assembly process of a typical consumer electronics product. The polymer pastes studied were from commercial paste manufacturers in USA, Europe and Japan. Additional background information, to help in understanding the behaviour of different polymer resistor materials, was obtained through the differential thermo analysis (DTA) of the pastes under investigation.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom