Open AccessMounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
Author(s) -
C. Val,
Jacques D. Agniel
Publication year - 1981
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.10.111
Subject(s) - ageing , mechanism (biology) , soldering , phase (matter) , materials science , metallurgy , chemistry , physics , medicine , organic chemistry , quantum mechanics
In this paper, the metallurgical aspect of conductor/solder/metallisation are analysed after cycling and ageing and the mechanism of degradation of the micro-solder is considered. As a consequence a new solder process of reflow is analysed (vapor phase reflow).
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