Open AccessApplication of CAD in Semifinished Product Packaging Art Design
Author(s) -
Yangyang Mao,
Tie Cheng Wu
Publication year - 2022
Publication title -
security and communication networks
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.446
H-Index - 43
eISSN - 1939-0114
pISSN - 1939-0122
DOI - 10.1155/2022/8937896
Subject(s) - cushioning , computer science , software , interface (matter) , cushion , engineering drawing , cad , packaging and labeling , product design , computer aided design , product (mathematics) , mechanical engineering , engineering , operating system , geometry , mathematics , bubble , maximum bubble pressure method
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