Polymers and Polymeric Composites with Electronic Applications
Author(s) -
Renbo Wei,
Xiufu Hua,
Zhiyuan Xiong
Publication year - 2018
Publication title -
international journal of polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.399
H-Index - 33
eISSN - 1687-9430
pISSN - 1687-9422
DOI - 10.1155/2018/8412480
Subject(s) - materials science , composite material , polymer , polymer science
The development of the modern society has resulted in all kinds of electronic equipment and devices that are composed of elements which are made from electronic materials. These electronic materials contain the ceramics such as silicon used for the fabrication of the chips, metals like copper which appears in the printed circuits, and the polymeric materials utilized as the insulation, packing, and isolation, among others. In comparing with the inorganic electronic materials, the polymer-based electronic materials have attracted considerable attention due to their relatively low density, flexibility, easy processing, low manufacturing cost, and even recyclable. As a result, polymers and polymeric composites have shown increasing applications as the components in the electronic equipment and devices. What is more, some newly developed polymeric electronic materials are taking the place of their inorganic counterparts. Basing on their electronic applications, this special issue focuses on the preparation, characterization, performances, and applications of some polymer-based electronic materials. Six original research papers and a review paper were collected in this special issue. These papers are themed on the fabrication and properties of polymeric electronic materials that can be potentially used as component in capacitors, solar cells, light emitting diode, and so on. The details of the topics in this special issue include the following: (1) effect of polar groups on the dielectric properties of dielectric polymers; (2) review of designing and preparing of high dielectric constant polymeric composites; (3) electric conductivity of polymeric composites with copper as a filler; (4) AC conductivity of polymeric composites with a conductive polymer as an additive; (5) designing of copolymers with optimized photoelectric properties through theoretical calculations; (6) microwave absorption properties of polyaniline and magnetite core-shell structured hybrid; and (7) polyimides as binder polymers on organic light-emitting diode panels. We expect that the related researchers will get inspired by this special issue.
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