Open AccessProcess to Improve the Adherences of Copper to a PTFE Plate
Author(s) -
Abel Pérez,
Alfonso Torres,
Reydezel TorresTorres
Publication year - 2016
Publication title -
indian journal of materials science
Language(s) - English
Resource type - Journals
ISSN - 2314-7490
DOI - 10.1155/2016/7419584
Subject(s) - copper , materials science , ultimate tensile strength , process (computing) , composite material , metallurgy , computer science , operating system
A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards
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