A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate | Zendy

Mohammed El Gibari | Zendy; Hongwu Li | Zendy

Open Access

A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate

Author(s) -

Mohammed El Gibari,

Hongwu Li

Publication year - 2015

Publication title -

international journal of antennas and propagation

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.282

H-Index - 37

eISSN - 1687-5877

pISSN - 1687-5869

DOI - 10.1155/2015/481768

Subject(s) - coplanar waveguide , microstrip , benzocyclobutene , materials science , optoelectronics , insertion loss , microwave , wafer , bandwidth (computing) , electronic circuit , waveguide , telecommunications , optics , electrical engineering , dielectric , computer science , physics , engineering

International audienceA comparative study between via-holed and via-free back-to-backGCPW-MS-GCPW (Grounded Coplanar Waveguide-Microstrip lines) transitions is reportedin this paper. According to simulation results, both via-holed and via-freetransitions on commercial benzocyclobutene polymer 20-µm film show a bandwidth over57 GHz. Bandwidth of optimized via-holed transitions increases with the via-holediameter, up to 75 GHz with 300 µm via-hole diameter. The via-hole freetransition achieves experimentally an ultra-broadband from 2 GHz to 78 GHz with an insertion loss of only0.5 dB thanks to the copper metallization thickness of 2 µm.In addition, these measurement results are in perfect agreement with thesimulation results. These via-free and via-holes transitions are very usefuland requested in component packaging, on-wafer measurements of microstrip basedmicrowave integrated circuits, and also in the interconnections in hybridcircuits including both microstrip and coplanar structures

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