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Thermal Transport between Graphene Sheets and SiC Substrate by Molecular-Dynamical Calculation
Author(s) -
Zan Wang,
Kedong Bi,
Huawei Guan,
Jiong Wang
Publication year - 2014
Publication title -
journal of materials
Language(s) - English
Resource type - Journals
eISSN - 2314-4874
pISSN - 2314-4866
DOI - 10.1155/2014/479808
Subject(s) - graphene , materials science , stacking , molecular dynamics , substrate (aquarium) , thermal , atmospheric temperature range , interfacial thermal resistance , non equilibrium thermodynamics , range (aeronautics) , chemical physics , silicon carbide , condensed matter physics , nanotechnology , composite material , thermal resistance , thermodynamics , computational chemistry , chemistry , nuclear magnetic resonance , physics , oceanography , geology
Using nonequilibrium molecular dynamics, we investigate the mechanisms of thermal transport across SiC/graphene sheets. In simulations, 3C-, 4H-, and 6H-SiC are considered separately. Interfacial thermal resistances between Bernal stacking graphene sheets and SiC (Si- or C-terminated) are calculated at the ranges of 100 K~700 K. The results indicate, whether Si-terminated or C-terminated interface, the interfacial thermal resistances of 4H- and 6H-SiC have similar trends over temperatures. Si-terminated interfacial thermal resistances of 3C-SiC are higher than those of 4H- and 6H-SiC in a wide temperature range from 100 K to 600 K. But, for C-rich interface, this range is reduced from 350 K to 500 K

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