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Stress Intensity Factor for Interface Cracks in Bimaterials Using Complex Variable Meshless Manifold Method
Author(s) -
Hongfen Gao,
Gaofeng Wei
Publication year - 2014
Publication title -
mathematical problems in engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.262
H-Index - 62
eISSN - 1026-7077
pISSN - 1024-123X
DOI - 10.1155/2014/353472
Subject(s) - stress intensity factor , displacement (psychology) , variable (mathematics) , regularized meshless method , materials science , stress (linguistics) , function (biology) , mathematical analysis , weight function , manifold (fluid mechanics) , structural engineering , mathematics , fracture mechanics , composite material , singular boundary method , engineering , finite element method , mechanical engineering , psychology , linguistics , philosophy , evolutionary biology , boundary element method , psychotherapist , biology
This paper describes the application of the complex variable meshless manifold method (CVMMM) to stress intensity factor analyses of structures containing interface cracks between dissimilar materials. A discontinuous function and the near-tip asymptotic displacement functions are added to the CVMMM approximation using the framework of complex variable moving least-squares (CVMLS) approximation. This enables the domain to be modeled by CVMMM without explicitly meshing the crack surfaces. The enriched crack-tip functions are chosen as those that span the asymptotic displacement fields for an interfacial crack. The complex stress intensity factors for bimaterial interfacial cracks were numerically evaluated using the method. Good agreement between the numerical results and the reference solutions for benchmark interfacial crack problems is realized

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