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Effects of Added Chloride Ion on Electrodeposition of Copper from a Simulated Acidic Sulfate Bath Containing Cobalt Ions
Author(s) -
Bijayalaxmi Panda
Publication year - 2013
Publication title -
isrn metallurgy
Language(s) - English
Resource type - Journals
ISSN - 2090-8717
DOI - 10.1155/2013/930890
Subject(s) - chloride , linear sweep voltammetry , copper , electrolyte , inorganic chemistry , chemistry , ion , sulfate , anode , cathode , cyclic voltammetry , scanning electron microscope , electrochemistry , materials science , electrode , organic chemistry , composite material
The effects of added chloride ion on copper electrodeposition was studied using Pb-Sb anode and a stainless steel cathode in an acidic sulfate bath containing added Co2

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