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Simulation and Experimental Investigation of Thermal Performance of a Miniature Flat Plate Heat Pipe
Author(s) -
Rabah Boukhanouf,
Assed Haddad
Publication year - 2013
Publication title -
advances in mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.318
H-Index - 40
eISSN - 1687-8140
pISSN - 1687-8132
DOI - 10.1155/2013/474935
Subject(s) - materials science , heat pipe , heat transfer , composite material , copper , thermal , thermal management of electronic devices and systems , base (topology) , heat sink , mechanics , mechanical engineering , thermodynamics , metallurgy , engineering , mathematical analysis , physics , mathematics
This paper presents the results of a CFD analysis and experimental tests of two identical miniature flat plate heat pipes (FPHP) using sintered and screen mesh wicks and a comparative analysis and measurement of two solid copper base plates 1 mm and 3 mm thick. It was shown that the design of the miniature FPHP with sintered wick would achieve the specific temperature gradients threshold for heat dissipation rates of up to 80 W. The experimental results also revealed that for localised heat sources of up to 40 W, a solid copper base plate 3 mm thick would have comparable heat transfer performances to that of the sintered wick FPHP. In addition, a marginal effect on the thermal performance of the sintered wick FPHP was recorded when its orientation was held at 0°, 90°, and 180° and for heat dissipation rates ranging from 0 to 100 W

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