Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review | Zendy

Liu Mei Lee | Zendy; Ahmad Azmin Mohamad | Zendy

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Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Author(s) -

Liu Mei Lee,

Ahmad Azmin Mohamad

Publication year - 2013

Publication title -

advances in materials science and engineering

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.356

H-Index - 42

eISSN - 1687-8442

pISSN - 1687-8434

DOI - 10.1155/2013/123697

Subject(s) - materials science , soldering , intermetallic , microelectronics , metallurgy , alloy , electronics , miniaturization , substrate (aquarium) , copper , interconnection , nanotechnology , computer science , oceanography , computer network , chemistry , geology

This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community

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