A Very Robust AlGaN/GaN HEMT Technology to High Forward Gate Bias and Current
Author(s) -
Bradley D. Christiansen,
Eric R. Heller,
Ronald A. Coutu,
Ramakrishna Vetury,
J.B. Shealy
Publication year - 2012
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.144
H-Index - 22
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/2012/493239
Subject(s) - high electron mobility transistor , optoelectronics , materials science , current (fluid) , breakdown voltage , gallium nitride , biasing , diode , threshold voltage , degradation (telecommunications) , voltage , electrical engineering , transistor , engineering , nanotechnology , layer (electronics)
Reports to date of GaN HEMTs subjected to forward gate bias stress include varied extents of degradation. We report an extremely robust GaN HEMT technology that survived—contrary to conventional wisdom—high forward gate bias (
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