Metallisation and Interconnection of e-Beam Evaporated Polycrystalline Silicon Thin-Film Solar Cells on Glass
Author(s) -
Tae-Kyun Kim,
Peter J. Gress,
Sergey Varlamov
Publication year - 2012
Publication title -
international journal of photoenergy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.426
H-Index - 51
eISSN - 1687-529X
pISSN - 1110-662X
DOI - 10.1155/2012/271738
Subject(s) - polycrystalline silicon , materials science , interconnection , optoelectronics , common emitter , fabrication , layer (electronics) , thin film , busbar , silicon , crystallite , aluminium , monocrystalline silicon , evaporation , electron beam physical vapor deposition , composite material , nanotechnology , electrical engineering , metallurgy , computer science , thin film transistor , medicine , computer network , alternative medicine , engineering , pathology , physics , thermodynamics
One inherent advantage of thin-film technology is the possibility of using monolithic integration for series interconnection of individual cells within large-area modules. Polycrystalline silicon thin-film solar cells do not rely on transparent conducting oxide layers as the high sheet conductivity of the emitter and BSF layers enables the lateral flow of current from the film to the metal contacts. This paper presents a new method for the fabrication of e-beam evaporated polycrystalline thin-film photovoltaic minimodules on glass. The method involves electrically isolating minicells, by laser scribing, and then forming an isolation layer on each laser scribe. The main advantage of this metallisation is to have a single aluminium evaporation step for the formation of finger and busbar features, as well as for series interconnection
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