17.6% Conversion Efficiency Multicrystalline Silicon Solar Cells Using the Reactive Ion Etching with the Damage Removal Etching
Author(s) -
Ji-Myung Shim,
HyunWoo Lee,
Kyeong-Yeon Cho,
Jae-Keun Seo,
JiSoo Kim,
Eun-Joo Lee,
Jun-Young Choi,
Dong-Joon Oh,
Jeong-eun Shin,
Jisun Kim,
Ji-Hyun Kong,
Soo-Hong Lee,
Hae-Seok Lee
Publication year - 2012
Publication title -
international journal of photoenergy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.426
H-Index - 51
eISSN - 1687-529X
pISSN - 1110-662X
DOI - 10.1155/2012/248182
Subject(s) - materials science , etching (microfabrication) , algorithm , analytical chemistry (journal) , computer science , chemistry , nanotechnology , layer (electronics) , chromatography
For lower reflectance, we applied a maskless plasma texturing technique using reactive ion etching (RIE) on acidic-textured multicrystalline silicon (mc-Si) wafer. RIE texturing had a deep and narrow textured surface and showed excellent low reflectance. Due to plasma-induced damage, unless the RIE-textured surfaces have the proper damage removal etching (DRE), they have a drop in Vocand FF. RIE texturing with a proper DRE had sufficiently higher short circuit current (Isc) than acidic-textured samples without a drop in open circuit voltage (Voc). And in order to improve efficiency of mc-Si solar cell, we applied RIE texturing with optimized DRE condition to selective emitter structure. In comparison with the acidic-textured solar cells, RIE-textured solar cells have above 200 mA absolute gain in Isc. And optimized RIE samples with a DRE by HNO3/HF mixture showed 17.6% conversion efficiency, which were made using an industrial screen printing process with selective emitter structure
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