Open AccessInvestigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate
Author(s) -
Jorge Tadao Matsushima,
Valéria Cristina Fernandes,
Andréa Boldarini Couto,
Maurício Ribeiro Baldan,
N.G. Ferreira
Publication year - 2011
Publication title -
international journal of electrochemistry
Language(s) - English
Resource type - Journals
eISSN - 2090-3537
pISSN - 2090-3529
DOI - 10.1155/2012/213420
Subject(s) - bimetallic strip , materials science , cyclic voltammetry , electrochemistry , electrode , diamond , scanning electron microscope , inorganic chemistry , composite number , nitrate , chemical engineering , metallurgy , chemistry , composite material , metal , organic chemistry , engineering
The Cu/Pd bimetallic system electrodeposited on boron-doped diamond (BDD) films for application, as electrode material in the electrochemical reduction of nitrate was studied. The electrochemical behavior of Cu, Pd, and Cu/Pd bimetallic system was evaluated by cyclic voltammetry. From these results, the formation of the Cu/Pd composite was verified. In addition, Cu with different phases and a Cu/Pd phase in the composite were obtained. Morphological analysis by scanning electron microscopy (SEM) revealed a homogeneous distribution of Cu/Pd bimetallic particles with intermediary dimensions compared to those observed in Cu or Pd electrodeposits separately. These composites were tested as electrocatalysts for nitrate reduction in Britton-Robinson buffer solution (pH 9). Electrochemical measurements showed that composites with higher Cu content displayed the best electrocatalytic activity for nitrate reduction, and the Cu/Pd phase in the bimetallic system served to improve the Cu adherence on BDD electrode
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