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Experimental Study of the Cooling of Electrical Components Using Water Film Evaporation
Author(s) -
Souad Harmand,
D. Pérez Gil,
Saâd Zouitene,
L. Remmerie,
Tewfik Benazzouz,
F. Cardarelli
Publication year - 2012
Publication title -
advances in mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.318
H-Index - 40
eISSN - 1687-8140
pISSN - 1687-8132
DOI - 10.1155/2012/183853
Subject(s) - evaporation , materials science , mechanics , heat flux , thermal conduction , latent heat , heat transfer , thermodynamics , front (military) , evaporative cooler , dissipation , composite material , meteorology , physics
Heat and mass transfer, which occur in the evaporation of a falling film of water, are studied experimentally. This evaporation allows the dissipation of the heat flux produced by twelve resistors, which simulate electrical components on the back side of an aluminium plate. On the front side of the plate, a falling film of water flows by the action of gravity. An inverse heat conduction model, associated with a spatial regularisation, was developed and produces the local heat fluxes on the plate using the measured temperatures. The efficiency of this evaporative process has been studied with respect to several parameters: imposed heat flux, inlet mass flow rate, and geometry. A comparison of the latent and sensible fluxes used to dissipate the imposed heat flux was studied in the case of a plexiglass sheet in front of the falling film at different distances from the aluminium plate

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