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Nanowires of Lead-Free Solder Alloy SnCuAg
Author(s) -
F.E. Atalay,
Deniz Işınsu Avşar,
H. Kaya,
V. Yagmur,
S. Atalay,
Turgay Seçki̇n
Publication year - 2011
Publication title -
journal of nanomaterials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.463
H-Index - 66
eISSN - 1687-4129
pISSN - 1687-4110
DOI - 10.1155/2011/919853
Subject(s) - materials science , differential scanning calorimetry , scanning electron microscope , alloy , nanowire , deposition (geology) , soldering , metallurgy , chemical engineering , analytical chemistry (journal) , composite material , nanotechnology , paleontology , chemistry , physics , chromatography , sediment , biology , engineering , thermodynamics
Ternary Sn88Ag5Cu7, Sn93Ag4Cu3, Sn58Ag18Cu24, Sn78Ag16Cu6, Sn90Ag4Cu6, Sn87Ag4Cu9 alloy nanowires were produced at various values of deposition potential by dc electrodeposition on highly ordered porous anodic alumina oxide (AAO) templates. During the deposition process some parameters, such as ion content, deposition time, pH, and temperature of the solution, were kept constant. The diameter and length of regular Sn93Ag4Cu3 nanowires electrodeposited at - 1V were determined by scanning electron microscopy (SEM) to be approximately 200-250nm and 7-8 µm, respectively. Differential scanning calorimetry (DSC) results indicate that the melting onset temperature of Sn93Ag4Cu3 nanowires is about 204°C.

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