Low-Temperature Strengths and Ductility of Various Tungsten Sheets
Author(s) -
Yutaka Hiraoka,
Hiroaki Kurishita
Publication year - 2011
Publication title -
advances in materials science and engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.356
H-Index - 42
eISSN - 1687-8442
pISSN - 1687-8434
DOI - 10.1155/2011/509457
Subject(s) - materials science , tungsten , ductility (earth science) , microstructure , scanning electron microscope , transgranular fracture , fracture (geology) , molybdenum , intergranular fracture , optical microscope , intergranular corrosion , metallurgy , composite material , grain size , creep
We used three kinds of tungsten sheets in this study. First, we examined microstructure such as grain size distribution using an optical microscope. Secondly, we carried out three-point bend tests at temperatures between about 290 and 500 K. Then, we examined fracture surface of a failed specimen using a scanning electron microscope. Lastly, by analyzing all these results, we evaluated apparent intergranular and transgranular fracture strengths and discussed strengths and ductility of tungsten. Additionally, we compared mechanical properties of tungsten with those of molybdenum
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