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Design and Comparison of 24 GHz Patch Antennas on Glass Substrates for Compact Wireless Sensor Nodes
Author(s) -
Florian Ohnimus,
Uwe Maaß,
Gerhard Fotheringham,
Brian Curran,
Ivan Ndip,
T. Fritzsch,
Jürgen Wolf,
Stephan Guttowski,
KlausDieter Lang
Publication year - 2010
Publication title -
international journal of microwave science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.125
H-Index - 11
eISSN - 1687-5834
pISSN - 1687-5826
DOI - 10.1155/2010/535307
Subject(s) - ground plane , microstrip antenna , patch antenna , microstrip , resonator , materials science , aperture (computer memory) , bandwidth (computing) , electrical engineering , optics , optoelectronics , electronic engineering , antenna (radio) , acoustics , engineering , physics , telecommunications
Three patch antennas suitable for integration and operation in a compact 24 GH wireless sensor node with radar and communication functions are designed, chareacterized, and compared. Theantenas are manufactured on a low loss glass wafer using thin film (BCB/Cu) wafer level processing (WLP) technologies. This process is well suited for 3D stacking. The antennas are fed through a microstrip line underneath a ground plane coupling into the patch resonator through a slot aperture. Linear polarization (LP), dual mode (DM) operation, and circular polarization (CP) are achieved through the layout of the slot aperture and ectangular patch dimensions. Antenna gain values of5.5dBi are obtained in addition to the 10 dB impedance bandwidths of 900 MHz and 1.3 GHz as well as 500 MHz CP bandwidth with a 3 dB axial ratio for the LP, DM, and CP patch antennas, respectivel

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