Three-Dimensional Modeling of the Heat-Affected Zone in Laser Machining Applications | Zendy

Martynas Beresna | Zendy; Titas Gertus | Zendy; Rolandas Tomašiūnas | Zendy; Hiroaki Misawa | Zendy; Saulius Juodkazis | Zendy

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Three-Dimensional Modeling of the Heat-Affected Zone in Laser Machining Applications

Author(s) -

Martynas Beresna,

Titas Gertus,

Rolandas Tomašiūnas,

Hiroaki Misawa,

Saulius Juodkazis

Publication year - 2008

Publication title -

laser chemistry

Language(s) - English

Resource type - Journals

eISSN - 1026-8014

pISSN - 0278-6273

DOI - 10.1155/2008/976205

Subject(s) - wafer dicing , laser , machining , laser cutting , thermal conductivity , thermal , dielectric , sapphire , thermal diffusivity , materials science , optoelectronics , composite material , optics , metallurgy , thermodynamics , physics , wafer

Thermal load as well as its three-dimensional (3D) spatial distribution has been estimated inside representative materials: glass (low thermal diffusion), silicon (semimetal properties), and sapphire (a crystalline dielectric of a high thermal conductivity) for typical laser processing and direct laser writing applications. The 3D temperature distribution allows to calculate thermal stress around the focal region. This provides an assessment tool for optimization of laser microprocessing conditions for controlled laser dicing and cutting applications

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