Sorption Behavior of Cu(II) From Acidic SolutionUsing Weathered Basalt Andesite Products | Zendy

Rajesh Singh | Zendy; Ajay V. Shah | Zendy; Bhavna A. Shah | Zendy

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Sorption Behavior of Cu(II) From Acidic SolutionUsing Weathered Basalt Andesite Products

Author(s) -

Rajesh Singh,

Ajay V. Shah,

Bhavna A. Shah

Publication year - 2007

Publication title -

journal of chemistry

Language(s) - English

Resource type - Journals

eISSN - 2090-9063

pISSN - 2090-9071

DOI - 10.1155/2007/790348

Subject(s) - sorption , freundlich equation , sorbent , langmuir , aqueous solution , copper , adsorption , chemistry , metal ions in aqueous solution , wastewater , metal , electroplating , inorganic chemistry , nuclear chemistry , environmental chemistry , environmental engineering , environmental science , organic chemistry , layer (electronics)

Wastewater discharged from electroplating industry pose a serious hazard due to their heavy metal load. The objective of this work is to evaluate the removal of Cu(II) from acidic solution by sorption onto Weathered Basalt Andesite Products (WBAP). WBAP has been characterized and utilized for removal of copper from aqueous solution over wide range of initial metal ion concentration (25 mg/L to 500 mg/L), contact duration (0-8 h), sorbent dose (5-35 g/L), pH (1.0 to 6.0), and temperature (276 K to 333 K). The sorption pattern of Cu ions onto WBAP followed Langmuir, Freundlich, and Dubinin- Kaganer-Radushkevich isotherms. The thermodynamic parameters (H0, S0, andG0) for Cu sorption onto WBAP were also determined.

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