A Molecular Dynamics Study of the Effect of Voids on the Deformation Behavior of Nanocrystalline Copper | Zendy

Zheng Chen | Zendy; YongWei Zhang | Zendy

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A Molecular Dynamics Study of the Effect of Voids on the Deformation Behavior of Nanocrystalline Copper

Author(s) -

Zheng Chen,

YongWei Zhang

Publication year - 2007

Publication title -

journal of nanomaterials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.463

H-Index - 66

eISSN - 1687-4129

pISSN - 1687-4110

DOI - 10.1155/2007/64589

Subject(s) - materials science , nanocrystalline material , copper , molecular dynamics , void (composites) , composite material , ultimate tensile strength , shear (geology) , deformation (meteorology) , metallurgy , nanotechnology , chemistry , computational chemistry

Molecular dynamics simulations are performed to study the effect of preexisting ellipsoidal voids on the tensile deformation behavior in nanocrystalline copper. No crack propagation is observed regardless of the orientation of the voids with respect to the tensile direction. However it is found that the voids may assist the shear plane formation via (1) emitting dislocations from the void tips, (2) relieving triple-junction confinement, and (3) catalyzing grain splitting

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