Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56% | Zendy

C. R. Tellier | Zendy; C. A. Hodebourg | Zendy; Stéphane Durand | Zendy

Open Access

Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56%

Author(s) -

C. R. Tellier,

C. A. Hodebourg,

Stéphane Durand

Publication year - 2001

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.144

H-Index - 22

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/2001/73462

Subject(s) - etching (microfabrication) , anisotropy , stereographic projection , surface micromachining , isotropic etching , dissolution , silicon , bulk micromachining , membrane , materials science , chemistry , crystallography , mineralogy , analytical chemistry (journal) , fabrication , geometry , nanotechnology , metallurgy , optics , chromatography , mathematics , physics , medicine , biochemistry , alternative medicine , layer (electronics) , pathology

This paper deals with the micromachining of various (h k 0) and (h h l) membrane–mesastructures in a NaOH 35% solution. Final etching shapes of micromachined structuresshow a marked anisotropy of type 1. Etching shapes are analysed in terms of thekinematic and tensorial model for the anisotropic dissolution of crystals. Some ofcrystallographic planes limiting membranes and mesa are identified from astereographic analysis of top contours. Conclusions of this study are in closeagreement with a previous work

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