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A New HEMT Breakdown Model IncorporatingGate and Thermal Effects
Author(s) -
Lutfi Albasha,
C.M. Snowden,
R.D. Pollard
Publication year - 1998
Publication title -
vlsi design
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.123
H-Index - 24
eISSN - 1065-514X
pISSN - 1026-7123
DOI - 10.1155/1998/37965
Subject(s) - high electron mobility transistor , quantum tunnelling , thermal , electronic engineering , materials science , channel (broadcasting) , work (physics) , optoelectronics , engineering , engineering physics , computer science , electrical engineering , mechanical engineering , transistor , physics , voltage , meteorology
This paper presents a comprehensive physical model for the breakdown process in HEMTs. The model is integrated into in a fast quasi-two-dimensional HEMT physical simulator. The work is based on a full study of the complex interactions between the different breakdown mechanisms and the influence of design parameters. The model takes account of tunnelling effects in the region of the gate metallization, and of the thermal effects in the active channel under the gate region.

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