Thermal Placement in Hybrid Circuits—A Heuristic Approach | Zendy

Andrzej Kos | Zendy; Gilbert De Mey | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Thermal Placement in Hybrid Circuits—A Heuristic Approach

Author(s) -

Andrzej Kos,

Gilbert De Mey

Publication year - 1994

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.144

H-Index - 22

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/1994/18548

Subject(s) - heuristic , electronic circuit , simple (philosophy) , computer science , thermal , electronic engineering , mathematical optimization , engineering , mathematics , electrical engineering , artificial intelligence , physics , philosophy , epistemology , meteorology

This paper deals with the placement of heat dissipating components in hybrid circuits. An optimumplacement is found when the extreme temperatures on the substrate are minimized. Whereas classicaltechniques such as the gradient method require large computational efforts, a simple and very rapidheuristic method is presented here. The heuristic approach offers the advantage that it can be easilyinserted in the design phase of the circuit

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research