Open AccessAdvanced Characterization of a Direct Wafer Bonding-compatible Germanium Exfoliation Process
Author(s) -
Isabelle Ferain,
Xiaolu Kou,
Caroline Moulet-Ventosa,
Mark S. Goorsky,
Cindy Colinge
Publication year - 2012
Publication title -
meeting abstracts/meeting abstracts (electrochemical society. cd-rom)
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2012-02/40/2995
Subject(s) - germanium , wafer , materials science , characterization (materials science) , exfoliation joint , wafer bonding , direct bonding , nanotechnology , optoelectronics , silicon , graphene
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