Open AccessEffect of Additives on Direct Copper Electrodeposition on Transition Metal Diffusion Barriers for Silicon-based Integrated Devices
Author(s) -
Byoungyong Im,
Sunjung Kim
Publication year - 2012
Publication title -
meeting abstracts/meeting abstracts (electrochemical society. cd-rom)
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2012-02/34/2736
Subject(s) - copper , silicon , transition metal , materials science , diffusion , nanotechnology , metal , metallurgy , chemical engineering , chemistry , catalysis , engineering , thermodynamics , organic chemistry , physics
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