Open AccessElectromigration Characteristics for Electron Down-Flow in Copper Interconnects
Author(s) -
Yi-Lung Cheng,
Wei-Yuan Chung,
Ying-Lang Wang
Publication year - 2011
Publication title -
meeting abstracts/meeting abstracts (electrochemical society. cd-rom)
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2011-01/21/1328
Subject(s) - electromigration , electron flow , copper , flow (mathematics) , materials science , copper interconnect , electron , metallurgy , composite material , mechanics , physics , nuclear physics
not Available.
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