Open AccessEffect of Centrifugal Force on Copper Electrodeposition for Through Silicon Via Filling
Author(s) -
Naoki Mizukoshi,
Atsuyoshi Suzuki,
Masanori Hayase
Publication year - 2010
Publication title -
ecs meeting abstracts
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2010-02/32/2007
Subject(s) - copper , centrifugal force , materials science , silicon , composite material , metallurgy , mechanics , physics , flow (mathematics)
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