Open AccessPad Conditioning for Scratch-Free, Cu Chemical-Mechanical Polishing (CuCMP)
Author(s) -
Thor Eusner,
Nannaji Saka,
JungHoon Chun
Publication year - 2010
Publication title -
meeting abstracts/meeting abstracts (electrochemical society. cd-rom)
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2010-02/21/1475
Subject(s) - scratch , polishing , conditioning , chemical mechanical planarization , materials science , copper , metallurgy , composite material , mathematics , statistics
not Available.
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