Open AccessThe Effect of Electrodeposited Copper Overburden Uniformity and Thickness on Post-Polish Planarity
Author(s) -
Brett Baker-O'Neal,
N. Lustig,
WeiTsu Tseng,
P. Flaitz,
TzeMan Ko,
Hariklia Deligianni
Publication year - 2006
Publication title -
ecs meeting abstracts
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2006-01/10/421
Subject(s) - overburden , planarity testing , copper , materials science , metallurgy , geology , composite material , mining engineering , chemistry , crystallography
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