Monitoring of Additives in Copper Plating Bath by Cyclic Voltammetric Stripping with a Microelectrode
Author(s) -
JianJun Sun,
Bu-Gao Xie,
Xiaobo Xie,
Guonan Chen
Publication year - 2006
Publication title -
meeting abstracts/meeting abstracts (electrochemical society. cd-rom)
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2005-01/7/349
Subject(s) - microelectrode , copper , stripping (fiber) , plating (geology) , copper plating , materials science , chemistry , metallurgy , electrode , electroplating , nanotechnology , composite material , physics , layer (electronics) , geophysics
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