Open AccessMultiple Level Plated Gold Interconnect for HEMT Compaction
Author(s) -
J. Uyeda,
Jennifer Wang,
Mike Barsky,
Ron Grundbacher,
Ke Luo,
Raffi Elmadjian,
Linh Dang,
Chi Shing Cheung,
Danny H.W. Li,
D. Farkas
Publication year - 2006
Publication title -
meeting abstracts/meeting abstracts (electrochemical society. cd-rom)
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2005-01/13/590
Subject(s) - compaction , interconnection , high electron mobility transistor , materials science , electrical engineering , engineering , telecommunications , composite material , transistor , voltage
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