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The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
Author(s) -
Lucia Lain Amador,
Jason Rolet,
MarieLaure Doche,
P. Massuti-Ballester,
M.P. Gigandet,
Virginie Moutarlier,
M. Taborelli,
L. Ferreira,
Paolo Chiggiato,
JeanYves Hihn
Publication year - 2019
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/2.1211908jes
Subject(s) - copper , outgassing , hydrogen , electroforming , materials science , electrolyte , analytical chemistry (journal) , chemistry , diffusion , atmospheric temperature range , inorganic chemistry , metallurgy , chemical engineering , electrode , nanotechnology , thermodynamics , chromatography , organic chemistry , layer (electronics) , engineering , physics

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