Open AccessCommunication—Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition
Author(s) -
Susumu Arai,
Mendsaikhan Munkhbat,
Koichi Nishimura
Publication year - 2015
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/2.0831602jes
Subject(s) - tin , materials science , nanostructure , copper , plating (geology) , copper plating , polyethylene glycol , fabrication , tin oxide , metallurgy , chemical engineering , composite material , nanotechnology , layer (electronics) , electroplating , oxide , medicine , alternative medicine , pathology , engineering , geophysics , geology
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom