Open AccessCopper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits
Author(s) -
Karel Haesevoets,
Aleksandar Radisic,
Philippe M. Vereecken
Publication year - 2019
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/2.0721908jes
Subject(s) - passivation , electrolyte , materials science , alloy , copper , benzotriazole , electrochemistry , nickel , metallurgy , inorganic chemistry , sulfate , chemical engineering , layer (electronics) , chemistry , electrode , nanotechnology , engineering
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