Open AccessEditors' Choice—In Situ Electrochemical Evaluation of Post-CMP Cleaning Reactions for Cobalt and Copper Films under Brushing Conditions
Author(s) -
C. A. Johnson,
D. Roy
Publication year - 2019
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2.0241905jss
Subject(s) - chemical mechanical planarization , materials science , copper , oxalate , electrochemistry , oxalic acid , cobalt , wafer , cleaning agent , dielectric spectroscopy , chemical engineering , inorganic chemistry , metallurgy , nanotechnology , electrode , chemistry , polishing , organic chemistry , engineering
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