Open AccessEnvironmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity
Author(s) -
N. Malik,
Hannah Tofteberg,
Erik Poppe,
T. G. Finstad,
Kari SchjølbergHenriksen
Publication year - 2015
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2.0201507jss
Subject(s) - materials science , composite material , wafer dicing , deflection (physics) , wafer , thermocompression bonding , bond strength , adhesive , optoelectronics , layer (electronics) , physics , optics
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