Open AccessMechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization
Author(s) -
Jun Wu,
Fred Wafula,
Sean P. Branagan,
Hideyuki Suzuki,
J. van Eisden
Publication year - 2018
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/2.0161901jes
Subject(s) - plating (geology) , trench , cobalt , electrochemistry , electrolysis , interconnection , cyclic voltammetry , hydrogen , materials science , chemistry , chemical engineering , electrode , nanotechnology , metallurgy , engineering , organic chemistry , physics , telecommunications , layer (electronics) , geophysics , electrolyte
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