English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Silicon (Si)-encapsulated III-V compound (III-V) device layers enable Si-complementary metal-oxide semiconductor (CMOS) friendly ohmic contact formation to III-V compound devices, allowing for the ultimate seamless planar integration of III-V and Si CMOS devices in a common fabrication infrastructure. A method of making ohmic contacts to buried III-V films using silicide metallurgies has been established. NiSi/Si/III-V dual heterojunction contact structures are found to be optimal for integration. These structures allow contact resistivities to be controlled by Si/III-V interfaces and eliminate interactions between the buried III-V device and metal layers. Using a modified transmission line method (TLM) test structure fabricated using standard CMOS processing techniques, the specific contact resistivities of Si/GaAs and Si/InxGa1-xAs interfaces are extracted. The relationship between specific contact resistivity and heterojuntion barrier width is considered. Among the structures tested in this work, p-type Si/GaAs and n-type Si/InxGa1-xAs yielded the lowest contact resistivities. Using the p-type Si/GaAs interface, a GaAs/AlxGa1-xAs laser with NiSi top contact is demonstrated, confirming the feasibility of NiSi/Si/III-V contact structures for III-V devices.Ratheon Company (Raytheon Integrated Device Systems funding

Silicon CMOS Ohmic Contact Technology for Contacting III-V Compound Materials