Open AccessHigh-Performance Extremely Low-k Film Integration Technology with Metal Hard Mask Process for Cu Interconnects
Author(s) -
Naoki Torazawa,
Susumu Matsumoto,
Takeshi Harada,
Yasunori Morinaga,
Daisuke Inagaki,
Tatsuya Kabe,
Shuji Hirao,
Kohei Seo,
Shigeru Suzuki,
Hayato Korogi,
H. Okamura,
Yusuke Kanda,
Masayuki Watanabe,
Muneyuki Matsumoto,
Kiyomi Hagihara,
Tetsuya Ueda
Publication year - 2016
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2.0141610jss
Subject(s) - materials science , low k dielectric , dielectric , optoelectronics , etching (microfabrication) , capacitance , process window , layer (electronics) , lithography , nanotechnology , electrode , chemistry
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom