Open AccessA Combined Process of Formic Acid Pretreatment for Low-Temperature Bonding of Copper Electrodes
Author(s) -
Wenhua Yang,
Masatake Akaike,
Masahisa Fujino,
Tadatomo Suga
Publication year - 2013
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2.010306jss
Subject(s) - formic acid , materials science , catalysis , oxide , copper , electrode , inorganic chemistry , copper oxide , chemical engineering , metallurgy , chemistry , organic chemistry , engineering
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