Open AccessReducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt%Ag-0.5 wt%Cu Solder
Author(s) -
Tai-Min Chang,
Fu-Hsin Chen,
Meng-Yen Chen,
YewChung Sermon Wu
Publication year - 2015
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2.0071509jss
Subject(s) - materials science , diamond , soldering , particle (ecology) , metallurgy , die (integrated circuit) , composite material , thermal resistance , thermal , nanotechnology , oceanography , physics , meteorology , geology
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom