Open AccessEffects of Ceria Abrasive Particle Size Distribution below Wafer Surface on In-Wafer Uniformity during Chemical Mechanical Polishing Processing
Author(s) -
Hojoong Kim,
Ji Chul Yang,
Myungjoon Kim,
Dong-won Oh,
Chilgee Lee,
Sang-Yong Kim,
Taesung Kim
Publication year - 2011
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1.3562559
Subject(s) - wafer , chemical mechanical planarization , abrasive , polishing , slurry , materials science , viscosity , composite material , particle size distribution , particle size , particle (ecology) , metallurgy , optoelectronics , chemical engineering , oceanography , engineering , geology
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